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my.TI Newsletter - November 02, 2008

--- On Sun, 11/2/08, Texas Instruments <myti@newsletters.ti.com> wrote:

From: Texas Instruments <myti@newsletters.ti.com>
Subject: my.TI Newsletter - November 02, 2008
To: shaiqbashir@yahoo.com
Date: Sunday, November 2, 2008, 4:16 AM

Texas Instruments
Hello Shaiq Bashir, November 02, 2008
Thank you for your interest in leading-edge technology from Texas Instruments. Here's your personalized source of news, updates and technical information about the products and applications that interest you.
Audio
TI introduces the lowest power 1.8-V audio codec with integrated miniDSP in production today
TI is introducing the TLV320AIC3254, a highly integrated audio codec in full production with leading consumer electronics companies to help them meet growing consumer demand for cost-efficient, feature-rich products with better audio quality and longer battery life. The 1.8-V codec combines integrated power management and dual miniDSP audio processing engines to save designers total audio solution cost and make it easier to design advanced audio features in handsets, portable navigation and portable media devices. TIâs PurePath⢠Studio development toolset further eases design complexity and speeds time to market. And the codecâs PowerTuneTM technology increases playback time by allowing designers to tune the device for optimum power use in each operating mode. The TLV320AIC3254 is available today in a space-saving 5 mm x 5 mm QFN-32 package from TI and its authorized distributors. For more information, samples and EVMs, please visit www.ti.com/tlv320aic3254. - More
eTech, Digital Media Focus newsletters redesigned
You spoke. We listened. TI has combined eTech and Digital Media Focus into a new monthly eTech Innovations Embedded Processing e-newsletter. It offers a "Featured System Block Diagram" and "Featured Video" and the latest news on A/V systems applications, DSPs, microcontrollers and more. Subscribe now.- More
Video and Imaging
Harman Kardon AVR pioneers TI DA710 audio DSP in a dual-DSP implementation
The newest Harman Kardon AVR 7550HD Audio/Video Receiver is the first to leverage TI's newest, high performance 32-bit DA710 Digital Audio Processor in a dual-DSP implementation. This implementation provides unprecedented processing capability and multichannel audio performance. The DA710 capability enabled Harman to incorporate a host of industry-leading innovations, including Dolby Volume, which improves the listening experience by leveling the volume from any source and program material, while maintaining optimum sound quality at any listening level.- More
Digital Still Camera
"TMS320DM35x DMSoC Asynchronous External Memory Interface User's Guide"
This document explains the EMIF's capability to connect a variety of external devices, including NAND flash, OneNAND flash, and asynchronous flash and SRAM, the most common use detailed in the "Example Configuration" section. Topics also covered include the EMIF's peripheral architecture, example configuration and registers. Download the PDF now.- More
TMS320DM335 Digital Media System-on-Chip SPI reference guide
A high-speed synchronous serial input/output port, the SPI shifts a serial bitstream of programmed length into and out of the device at a programmed bit-transfer rate. It typically accommodates communication between the DMSoC and external peripherals. Learn more now.- More
Industrial
TMS320C6474 multicore digital signal processor
If your design requires a high performance multicore DSP, TI's C6474 offers cost-effective solutions to high performance DSP programming challenges with three independent DSP subsystems. As the highest-performance multicore DSP on the TMS320C6000 platform, it possesses the operational flexibility of high-speed controllers. Learn more now.- More
Webcast: Multi-core solutions for high-density applications
Don't miss the Nov. 5 webcast featuring TI and VirtualLogix technologists in a 60-minute discussion of multi-core solutions for high-density applications and TI's current roadmap for future solutions for high-performance applications. Register now, and ensure your preview of TI's next multi-core solution.- More

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